This module is critical for circuit design quality, accurately modeling the geometry of the semiconductor die's layout and the adverse effects of physical phenomena
Parasitic Extraction (PEX) Module
This module is critical for circuit design quality, accurately modeling the geometry of the semiconductor die's layout and the adverse effects of physical phenomena
Key Advantages of Our Solution
Extraction of parasitic parameters—including resistance, capacitance, and self/mutual inductance—directly from the geometrical properties of the custom chip layout
Advanced process stack visualization with comprehensive support for 2D and 3D profiles of conductive and dielectric layers
AI-driven approximation algorithms enabling high-throughput and rapid estimation of parasitic element values without compromising computational efficiency
Elevated accuracy in parasitic component valuation, facilitated by integrated high-precision numerical solvers
Native integration with analog IC EDA environments and Process Design Kits (PDKs), enhancing design fidelity and maximizing production yield
Compatibility with semiconductor process technologies from leading Russian silicon foundries